New Material for Soft Bioelectronics
May 18, 2021 | Terry Sharrer

Ag-hydrogel composite for soft bioelectronics
“Researchers in Carnegie Mellon University’s Soft Machines Lab have developed a unique silver-hydrogel composite that has high electrical conductivity and is capable of delivering direct current while maintaining soft compliance and deformability. . . . The team suspended micrometer-sized silver flakes in a polyacrylamide-alginate hydrogel matrix. After going through a partial dehydration process, the flakes formed percolating networks that were electrically conductive and robust to mechanical deformations. By manipulating this dehydration and hydration process, the flakes can be made to stick together or break apart, forming reversible electrical connections.” MORE
Image Credit: CMU Soft Machines Lab and Techxplore.com